Power chips are attached to external circuits with packaging, and their efficiency relies on the support of the packaging. In high-power circumstances, power chips are usually packaged as power modules. Chip interconnection describes the electrical link on the upper surface area of the chip, which is typically light weight aluminum bonding wire in traditional modules. ^
Standard power component plan cross-section
Today, industrial silicon carbide power components still primarily make use of the packaging modern technology of this wire-bonded traditional silicon IGBT component. They encounter troubles such as huge high-frequency parasitic parameters, insufficient warmth dissipation capacity, low-temperature resistance, and insufficient insulation strength, which limit making use of silicon carbide semiconductors. The screen of exceptional performance. In order to address these troubles and completely exploit the significant potential advantages of silicon carbide chips, many new product packaging technologies and remedies for silicon carbide power components have emerged in the last few years.
Silicon carbide power module bonding technique
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have actually created from gold cable bonding in 2001 to light weight aluminum cord (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have actually developed from gold cords to copper cables, and the driving pressure is cost decrease; high-power gadgets have established from aluminum cables (strips) to Cu Clips, and the driving pressure is to boost product efficiency. The higher the power, the higher the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging process that uses a solid copper bridge soldered to solder to link chips and pins. Compared with traditional bonding packaging approaches, Cu Clip innovation has the following advantages:
1. The connection in between the chip and the pins is made of copper sheets, which, to a certain extent, replaces the standard cable bonding technique in between the chip and the pins. As a result, an unique plan resistance worth, greater existing flow, and better thermal conductivity can be gotten.
2. The lead pin welding area does not require to be silver-plated, which can fully conserve the price of silver plating and bad silver plating.
3. The product appearance is entirely constant with regular items and is generally made use of in web servers, portable computers, batteries/drives, graphics cards, motors, power materials, and various other fields.
Cu Clip has 2 bonding approaches.
All copper sheet bonding approach
Both the Gate pad and the Resource pad are clip-based. This bonding technique is more expensive and intricate, yet it can accomplish much better Rdson and far better thermal results.
( copper strip)
Copper sheet plus wire bonding approach
The source pad uses a Clip method, and the Gate uses a Cord method. This bonding method is somewhat less expensive than the all-copper bonding method, saving wafer area (applicable to very tiny entrance areas). The procedure is easier than the all-copper bonding approach and can get much better Rdson and much better thermal result.
Vendor of Copper Strip
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